30th-Nov-23, 12:17 PM
COMPONENT REMOVAL TECHNIQUE
Before getting into the specifics of decoder repair, first a technique for removal of surface mount components without damaging the underlying thin copper pads and tracks.
We will use the technique for removing three pin devices know as SOT-23 package. The same technique can be applied to larger packages such as TSSOP-14 as used for the microcontrollers in standard SSD decoders. It can even be used for successful removal of the 64 pin microcontrollers inside the APB.
So the technique involves three steps.
Step 1 - add fresh lead/tin solder to each of the three pins to build up a small ‘ball’ of additional solder. This serves two purposes, first it dilutes the earlier applied solder which will be lead-free so melts at higher temperature. The dilution effect lowers the melting temperature making the task easier. Second, the increased volume of solder helps retain heat during the next step.
Step 2 - This step is about raising the temperature of all three pins so that the part can be removed. Here we apply the soldering iron to each pin in turn - holding the soldering iron tip in place for approx 1 second before moving to the next pin. After approx 10 rotations, gently ‘tap’ the part sideways with the tip of the iron. If the solder at all three pins is molten the part will move sideways without causing any damage. If the part doesnt move, repeat heating rotation for another 10-30 seconds.
Once the part has moved, it can be retrieved with tweezers.
Step 3 - The final step is to clean the solder pads (three in this case). Here the technique is to apply some fresh solder using a nicely cleaned soldering iron tip. Fresh solder applied direct to the pad will be drawn towards the tip of the iron as the iron is withdrawn - leaving a nicely conditioned pad surface for future attachment of a new part.
With all of the above steps, practice makes perfect. As mentioned the technique can be applied, even, to the removal of 64 pin microcontrollers - but definitely good to learn to walk before learning to run
I hope this is of interest to at least some forum members.
c
Before getting into the specifics of decoder repair, first a technique for removal of surface mount components without damaging the underlying thin copper pads and tracks.
We will use the technique for removing three pin devices know as SOT-23 package. The same technique can be applied to larger packages such as TSSOP-14 as used for the microcontrollers in standard SSD decoders. It can even be used for successful removal of the 64 pin microcontrollers inside the APB.
So the technique involves three steps.
Step 1 - add fresh lead/tin solder to each of the three pins to build up a small ‘ball’ of additional solder. This serves two purposes, first it dilutes the earlier applied solder which will be lead-free so melts at higher temperature. The dilution effect lowers the melting temperature making the task easier. Second, the increased volume of solder helps retain heat during the next step.
Step 2 - This step is about raising the temperature of all three pins so that the part can be removed. Here we apply the soldering iron to each pin in turn - holding the soldering iron tip in place for approx 1 second before moving to the next pin. After approx 10 rotations, gently ‘tap’ the part sideways with the tip of the iron. If the solder at all three pins is molten the part will move sideways without causing any damage. If the part doesnt move, repeat heating rotation for another 10-30 seconds.
Once the part has moved, it can be retrieved with tweezers.
Step 3 - The final step is to clean the solder pads (three in this case). Here the technique is to apply some fresh solder using a nicely cleaned soldering iron tip. Fresh solder applied direct to the pad will be drawn towards the tip of the iron as the iron is withdrawn - leaving a nicely conditioned pad surface for future attachment of a new part.
With all of the above steps, practice makes perfect. As mentioned the technique can be applied, even, to the removal of 64 pin microcontrollers - but definitely good to learn to walk before learning to run

I hope this is of interest to at least some forum members.
c